Program Overview

This doctoral program adheres to student-centered approach, guided by the improvement of original innovation and engineering practice abilities, and focuses on cultivating a group of high-level innovative talents and industry backbone in the field of modern electronic information with solid basic knowledge, high professional literacy, strong innovation and practical ability, a sense of mission, responsibility, and a good international perspective.

Research directions in this field: conductor heterojunction integration and advanced packaging, semiconductor manufacturing and processes, integrated circuit devices and design.

Core Courses

Modern Signal Processing, RF and mixed signal integrated circuit design, Optimization Theory and Applications, Modern Data Fusion Technology,Advanced Semiconductor Device Physics, etc.

Career Prospects

Industry, Postdoc, Research Institute, etc.

Enquiry

Email:[email protected]                    

英文名

Junfa Mao

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

毛軍發(fā)，中國(guó)科學(xué)院院士，深圳大學(xué)校長(zhǎng)。曾擔(dān)任上海交通大學(xué)副校長(zhǎng)。1992 年于上海交通大學(xué)獲博士學(xué)位。1994年-1996年在香港中文大學(xué)和美國(guó)加州大學(xué)伯克利分校各做了1年訪(fǎng)問(wèn)研究。主要研究高速與射頻集成電路，以及智能感知技術(shù)。他是中國(guó)電子學(xué)會(huì)會(huì)士、微波分會(huì)主任委員，中國(guó)通信學(xué)會(huì)會(huì)士，IEEE Fellow，973首席，國(guó)家自然基金委杰出青年基金獲得者、創(chuàng)新群體學(xué)術(shù)帶頭人以及基礎(chǔ)科學(xué)中心項(xiàng)目負(fù)責(zé)人。發(fā)表論文500多篇，其中IEEE 刊物論文160多篇。先后獲國(guó)家自然科學(xué)獎(jiǎng)二等獎(jiǎng)、國(guó)家技術(shù)發(fā)明獎(jiǎng)二等獎(jiǎng)、國(guó)家科技進(jìn)步獎(jiǎng)二等獎(jiǎng)各 1 項(xiàng)，國(guó)家教學(xué)成果二等獎(jiǎng)2項(xiàng)，負(fù)責(zé)的成果獲2020年中國(guó)高等學(xué)校十大科技進(jìn)展。

英文簡(jiǎn)介

Junfa Mao, CAS Academician, President of Shenzhen University. He was the Vice President of Shanghai Jiao Tong University. He received his Ph.D. degree from Shanghai Jiao Tong University in 1992. He was a Visiting Scholar at the Chinese University of Hong Kong (1994-1995) and the University of California, Berkeley (1995-1996). His main research interests include high-speed radio frequency integrated circuits and intelligent sensing technology. He is a fellow of the Chinese Institute of Electronics (CIE), the director of the Microwave Society of CIE, a fellow of the China Institute of Communications, IEEE Fellow, the Cheung Kong Scholar of the Ministry of Education, the Chief Scientist of the National Basic Research Program (973 Program) of China, a recipient of the National Science Fund for Distinguished Young Scholars, the Academic Leader of the Creative Research Groups of the National Natural Science Foundation of China and the Project Manager of the Fundamental Scientific Center.

He has authored or coauthored more than 500 papers (including more than 160 IEEE journal papers). He received the National Natural Science Award of China, the National Technology Invention Award of China, the National Science and Technology Advancement Award of China and two National Awards of Teaching. His research achievement was selected as one of Ten Major Scientific and Technological Progress of China's Colleges and Universities (2020).

英文名

Feng Rao

聯(lián)系郵箱

f[email protected]

中文簡(jiǎn)介

饒峰，特聘教授。主要研究領(lǐng)域?yàn)榘雽?dǎo)體信息功能材料與器件，研究方向包括（1）新型相變信息存儲(chǔ)材料與器件、（2）外場(chǎng)作用下納米材料行為原位表征、（3）非晶態(tài)半導(dǎo)體材料選通材料與器件、（4）二維與異質(zhì)結(jié)薄膜材料與器件。已發(fā)表Science、Mater. Today、Nat. Commun.、Nano Lett.等第一/通訊作者論文70余篇；獲中國(guó)授權(quán)專(zhuān)利40余項(xiàng)，美國(guó)專(zhuān)利5項(xiàng)。

英文簡(jiǎn)介

Prof. Feng Rao’s main research field is semiconductor informatic functional materials and devices, with research directions including (1) novel phase-change memory materials and devices, (2) in-situ characterization of nanomaterials behaviors under external stimuli, (3) amorphous semiconductor materials for selector applications, and (4) 2D and heterostructured film and devices. He has published over 70 peer reviewed articles, including some in prestigious journals, such as Science, Mater. Today, Nat. Commun., Nano Lett., etc, and also has been authorized over 40 Chinese and 5 US patents.

英文名

Mark Huang

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

深圳孔雀A海外高層次人才（2019）， 深圳大學(xué)電子與信息工程學(xué)院和異質(zhì)異構(gòu)國(guó)家重點(diǎn)實(shí)驗(yàn)室特聘教授，微電子研究院封測(cè)中心主任（2021-）），寧波大學(xué)材化學(xué)院安中講習(xí)教授（2018-2023），新加坡國(guó)立大學(xué)博士后（1996-1998），中國(guó)科學(xué)院化學(xué)研究所高分子化學(xué)博士（1996），在新加坡和美國(guó)工作18年，先后服務(wù)于日立化成（HCAP）任高級(jí)工程師，美光科技（Micron）任主任研究員，星科金朋（StatschipPAC）任高級(jí)經(jīng)理，新加坡微電子研究所（IME）任技術(shù)顧問(wèn)，瑞士SFS集團(tuán)旗下Unisteel公司技術(shù)總監(jiān)。2014回國(guó)加入碩貝德無(wú)線(xiàn)科技（SPEED）任CTO負(fù)責(zé)TSV制造和指紋模組封裝技術(shù)開(kāi)發(fā)。

專(zhuān)業(yè)特長(zhǎng)：

①各種類(lèi)型IC封裝材料的應(yīng)用和技術(shù)攻關(guān)；

②先進(jìn)組裝技術(shù)開(kāi)發(fā)與商業(yè)化，包括封裝倒裝芯片（FCIP）、系統(tǒng)封裝/多芯片模組（SiP/MCM）、晶圓級(jí)芯片封裝（WLCSP），銅柱互連（Cu-Pillar），硅通孔（TSV）和扇出扳 級(jí)封裝（FOPLP）；

③超薄晶片處理和成本可行的封裝解決方案；

④技術(shù)創(chuàng)新，共發(fā)表論文50余篇，持有美國(guó)專(zhuān)利60項(xiàng)，新加坡專(zhuān)利2項(xiàng)，中國(guó)發(fā)明專(zhuān)利10項(xiàng)，實(shí)用新型專(zhuān)利32項(xiàng)。

研究興趣: 高頻高速新材料開(kāi)發(fā)和應(yīng)用，半導(dǎo)體封裝技術(shù)(IC Assembly)，無(wú)線(xiàn)充電(WC)，物聯(lián)網(wǎng)（IoT）和車(chē)聯(lián)網(wǎng)（IoV）解決方案等。自2012年擔(dān)任中國(guó)半導(dǎo)體國(guó)際技術(shù)大會(huì)委員會(huì)委員兼封裝分會(huì)聯(lián)席主席（Co-Chair）。

成功商業(yè)化案例：1. 在新加坡工作期間，帶領(lǐng)研發(fā)團(tuán)隊(duì)成功開(kāi)發(fā)全球首款PVD緊固件產(chǎn)品用于蘋(píng)果手機(jī)5系列；2.開(kāi)發(fā)性?xún)r(jià)比高的高阻隔密封材料可用于替代玻璃/陶瓷/金屬的封裝材料；

3.回國(guó)后開(kāi)發(fā)全球首款硅通孔（TSV）指紋芯片工藝和新產(chǎn)品，用于華為手機(jī)。

英文簡(jiǎn)介

National Distinguished Expert (2016), Shenzhen Peacock Plan Overseas High-Level Talents (2019), Distinguished Professor at Shenzhen University, School of Electronics and Information Engineering, Director of the Assembly and Testing Center at the Microelectronics Research Institute (2021-), Guest Professor at the College of Materials and Chemistry, Ningbo University (2018-), Postdoctoral Research Fellow at the National University of Singapore (1996-1998), Ph.D. in Polymer Chemistry from the Institute of Chemistry, Chinese Academy of Sciences (1996). Worked in Singapore and the United States for 18 years, serving as a Senior Engineer at Hitachi Chemical Advanced Packaging (HCAP), Director of Research at Micron Technology, Senior Manager at StatschipPAC, Technical Consultant at the Institute of Microelectronics (IME) in Singapore, and Technical Director at Unisteel, a subsidiary of the Swiss SFS Group. Returned to China in 2014 and joined Supebed Wireless Technology (SPEED) as the CTO, responsible for TSV manufacturing and fingerprint module packaging technology development.

Areas of expertise:

l Application and technical research of various types of IC packaging materials.

l Development and commercialization of advanced assembly technologies, including Flip Chip in Package (FCIP), System-in-Package/Multi-Chip Module (SiP/MCM), Wafer-Level Chip-Scale Packaging (WLCSP), Copper Pillar Interconnect (Cu-Pillar), Through-Silicon Via (TSV), and Fan-Out Panel-Level Packaging (FOPLP).

l Ultra-thin wafer handling and cost-effective packaging solutions.

l Technological innovation, with over 72 published papers, 70 granted US patents, 2 Singapore patents, 10 Chinese invention patents, and 32 utility model patents.

Research interests:

l Development and application of high-frequency and high-speed new materials, semiconductor packaging technology (IC Assembly), wireless charging (WC), solutions for the Internet of Things (IoT) and the Internet of Vehicles (IoV). Since 2012, serving as a committee member and co-chair of the Packaging Subcommittee of the China Semiconductor International Technology Conference.

l Successful commercialization cases:

n During my tenure in Singapore, led a research and development team to successfully develop the world's first PVD fastener product for the Apple iPhone 5 series.

n Developed high-cost-performance barrier sealant materials as alternatives to glass/ceramic/metal packaging materials.

n After returning to China, developed the world's first TSV fingerprint chip process and new product for Huawei smartphones.

英文名

Sai-Wai Wong

聯(lián)系郵箱

w[email protected]

中文簡(jiǎn)介

王世偉，男，香港人，2017年10月加盟深圳大學(xué)，任電子與信息工程學(xué)院長(zhǎng)聘教授。2003年獲香港科技大學(xué)電子工程本科學(xué)士學(xué)位，2003-2004分別在兩家香港企業(yè)擔(dān)任工程部主管。2005年和2009年分別獲新加坡南洋理工大學(xué)碩士和博士學(xué)位，2009-2010年聘為新加坡科技研究家資訊通信研究院研究員，2010-2016年任華南理工大學(xué)副教授、碩導(dǎo)，2016-2017年任華南理工大學(xué)教授、博導(dǎo)。教育部新世紀(jì)優(yōu)秀人才支持計(jì)劃入選者（2013），2018年獲深圳海外高層次人才孔雀C類(lèi)人才，2014年IEEE高級(jí)會(huì)員。發(fā)表學(xué)術(shù)論文200余篇，谷歌引用超過(guò)4000次，H因子31，獲授權(quán)發(fā)明專(zhuān)利超過(guò)60項(xiàng)，美國(guó)專(zhuān)利一項(xiàng)。主持國(guó)家自然科學(xué)基金項(xiàng)目和省市級(jí)項(xiàng)目多項(xiàng)。主要研究領(lǐng)域：微波電路與天線(xiàn)。

英文簡(jiǎn)介

Sai-Wai Wong received his B.S degree in electronic engineering from the Hong Kong University of Science and Technology, Hong Kong, in 2003, and the M.Sc. and Ph.D. degrees in communication engineering from Nanyang Technological University, Singapore, in 2006 and 2009, respectively. From Jul. 2003 to Jul. 2005, he was an Electronic Engineer to lead an electronic engineering department in China with two Hong Kong manufacturing companies. From May 2009 to Oct. 2010, he was a Research Fellow with the Institute for Infocomm Research, Singapore. Since November 2010, He was an Associate Professor and later bcome a Professor, in the School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China. From Jul. 2016 to Sep. 2016, he is a Visiting Professor in City University of Hong Kong. Since 2017, He is a tenured Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen. His research interests include microwave/mmW/Terahertz circuit and antenna design. So far, he has authored and co-authored more than 200 papers in international journals and conference proceedings. His google paper citation is more than 4000 times. He holds more than 60 licensed Chinese invention patents and 1 USA patent. He has been serving as a reviewer for several top-tier journals such as IEEE TMTT, MWCL, AP and so on. He was the recipient of the New Century Excellent Talents in University awarded by the Ministry of Education of China in 2013. He is also the recipent of Overseas High-Caliber Personnal (Level C) in 2018.

英文名

Bin Liao

聯(lián)系郵箱

b[email protected]

中文簡(jiǎn)介

廖斌，教授，新銳研究生導(dǎo)師，博士生導(dǎo)師，廣東省智能信息處理重點(diǎn)實(shí)驗(yàn)室副主任。于2006年，2009年分別獲得西安電子科技大學(xué)電子信息工程學(xué)士和信息與信息處理碩士學(xué)位，2013年獲得香港大學(xué)電機(jī)與電子工程系博士學(xué)位。主要從事陣列信號(hào)處理，雷達(dá)信號(hào)處理、無(wú)線(xiàn)通信、通感一體化等研究。入選全球前2%頂尖科學(xué)家榜單，“終身科學(xué)影響力排行榜”，國(guó)家自然科學(xué)基金委員會(huì)與歐盟委員會(huì)“中歐人才項(xiàng)目”獲得者，"廣東特支計(jì)劃" 科技創(chuàng)新青年拔尖人才，深圳大學(xué)優(yōu)秀青年教師“荔園優(yōu)青”，深圳市海外高層次人才（孔雀計(jì)劃）B類(lèi)，南山區(qū)“領(lǐng)航人才”B類(lèi)獲得者。獲得教育部自然科學(xué)二等獎(jiǎng)，第21屆（北京）和第22屆（倫敦）IEEE數(shù)字信號(hào)處理國(guó)際會(huì)議最佳論文獎(jiǎng)，陜西省優(yōu)秀畢業(yè)生，西安電子科技大學(xué)優(yōu)秀畢業(yè)生，研究生優(yōu)秀碩士學(xué)位論文特等獎(jiǎng)，中國(guó)航天科技集團(tuán)公司CASC一等獎(jiǎng)學(xué)金等。主持10余項(xiàng)縱向科研項(xiàng)目，其中國(guó)家自然科學(xué)基金項(xiàng)目4項(xiàng)。在權(quán)威國(guó)際期刊和會(huì)議上發(fā)表論文150余篇?，F(xiàn)為IEEE高級(jí)會(huì)員，IEEE 傳感器陣列與多通道信號(hào)處理 （SAM）技術(shù)委員會(huì)委員，擔(dān)任IEEE Transactions on Aerospace and Electronic Systems，Multidimensional Systems and Signal Processing（Springer），IET Signal Processing 等期刊副編輯（Associate Editor）。

英文簡(jiǎn)介

Bin Liao (Senior Member, IEEE) received the B.Eng. and M.Eng. degrees from Xidian University, Xi’an, China, in 2006 and 2009, respectively, and the Ph.D. degree from the University of Hong Kong, Hong Kong, in 2013. From 2013 to 2014, he was a Research Assistant with the Department of Electrical and Electronic Engineering, The University of Hong Kong, where he was also a Research Scientist with the Department of Electrical and Electronic Engineering from August to October 2016. From March to June 2023, he was a Visiting Professor with the Centre for Wireless Innovation (CWI), Queen’s University Belfast, U.K. He is currently a Full Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. His research interests include sensor array processing, adaptive filtering, and convex optimization, with applications to radar, navigation, and communications. He was a recipient of the Best Paper Award in 2016 21st International Conference on Digital Signal Processing and 2017 22nd International Conference on Digital Signal Processing. He was a recipient of the National Natural Science Foundation of China and European Research Council (NSFC-ERC) programme. He is an Associate Editor of IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, IET Signal Processing, and Multidimensional Systems and Signal Processing.

英文名

Zhaocheng Yang

聯(lián)系郵箱

y[email protected]

中文簡(jiǎn)介

陽(yáng)召成，男，1984年生，博士，副教授，深圳大學(xué)新銳導(dǎo)師，軍隊(duì)三等功獲得者，省優(yōu)秀博士論文獲得者，深圳市南山區(qū)“領(lǐng)航人才”，深圳市海外高層次“孔雀計(jì)劃”人才。2007年6月和 2013 年6月分別獲北京理工大學(xué)學(xué)士和國(guó)防科學(xué)技術(shù)大學(xué)信息與通信工程專(zhuān)業(yè)工學(xué)博士學(xué)位。2010年11月-2011年11月在University of York從事訪(fǎng)問(wèn)研究；2013年6月-2015年8月在國(guó)防科技大學(xué)任教，2015年9月-至今在深圳大學(xué)任教。在雷達(dá)領(lǐng)域從事科研工作15年多，其研究方向?yàn)橹悄芨兄走_(dá)與信息處理，其技術(shù)涉及雷達(dá)信號(hào)處理、多傳感器智能感知、陣列信號(hào)處理、稀疏表示、自動(dòng)目標(biāo)識(shí)別等。主持了國(guó)家、省多項(xiàng)自然科學(xué)基金、深圳市科技項(xiàng)目、企業(yè)合作橫向項(xiàng)目等十余項(xiàng)，參與國(guó)家自然科學(xué)基金、973、863等項(xiàng)目多項(xiàng)。目前，撰寫(xiě)個(gè)人專(zhuān)著1本，獲得/申請(qǐng)國(guó)家發(fā)明專(zhuān)利60余項(xiàng)。在國(guó)內(nèi)外高水平學(xué)術(shù)期刊和會(huì)議上發(fā)表和錄用學(xué)術(shù)論文90余篇，其中SCI檢索40余篇，榮獲2018年IET工程技術(shù)協(xié)會(huì)最佳論文獎(jiǎng)。

英文簡(jiǎn)介

Zhaocheng Yang received the B.E. degree in information engineering from the Beijing Institute of Technology, Beijing, China, in 2007, and the Ph.D. degree in information and communication engineering from the National University of Defense Technology, Changsha, China, in 2013. From November 2010 to November 2011, he was a Visiting Scholar with the University of York, York, U.K. From June 2013 to August 2015, he was a Lecturer with the School of Electronics Science and Engineering, National University of Defense Technology. He is currently an Associate Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. He served as the reviewer and the TPC member for many IEEE journals and conferences. His research interests include the area of array signal processing, adaptive signal processing, compressive sensing, machine learning, and edge intelligent sensing radar and its applications. He has published 1 book, more than 90 papers in journals/conferences and over 60 granted patents. He won the Excellent Doctoral Thesis of Hunan province, China, in 2015, and the IET Premium Awards for the best journal paper published in IET Signal Processing in 2018.

英文名

SHI Weiwei, Will

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

博士畢業(yè)于香港中文大學(xué)，主要研究方向?yàn)楦吣苄У凸臄?shù)字集成電路設(shè)計(jì)，可穿戴腦機(jī)交互芯片及高效益邊緣計(jì)算人工智能芯片。及近年在國(guó)際會(huì)議和雜志上發(fā)表了二十余篇相關(guān)論文，其中近三年發(fā)表和收錄了十篇以上關(guān)于神經(jīng)疾病腦電監(jiān)控芯片、亞閾值數(shù)字/邏輯設(shè)計(jì)的國(guó)際會(huì)議和雜志論文（IEEE TCAS、TCAD、Access等等，IF 4.1-2.4）。

主持承擔(dān)國(guó)家自然科學(xué)基金面上項(xiàng)目、廣東省自然科學(xué)基金面上項(xiàng)目、廣東省青年創(chuàng)新人才項(xiàng)目及深圳市科技計(jì)劃項(xiàng)目等多個(gè)項(xiàng)目，作為主持人已結(jié)題及在研的經(jīng)費(fèi)總額達(dá)390萬(wàn)以上，具有豐富的項(xiàng)目開(kāi)展經(jīng)驗(yàn)。

英文簡(jiǎn)介

SHI Weiwei received the Ph.D. degree in electronic engineering from the Chinese University of Hong Kong (CUHK) in 2011. He is now an associate professor in the Department of Microelectronics in Shenzhen University. His current research interests include digital system designs, especially IC designs on cost-and-energy efficient AI chips, approximate computation, subthreshold digital system, human-computer interface chips, and baseband processor in communication.

He has published over 20 papers in international conferences and key academic journals in recent years (IEEE TCAS, TCAD, Access and etc.), mainly on brain-computer interface chips, subthreshold digital designs and baseband processors. He has been appointed as PI for over 10 projects in recent 5 years supported by national and regional funds with over 4,500,000 RMB amount and abundant R & D experiences.

英文名

Xinke Liu

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

劉新科， 深圳大學(xué)副教授/研究員，博士研究生導(dǎo)師，Fellow of the Institute of Physics (FInstP)、Fellow of the Royal Society of Chemistry (FRSC)、IEEE Senior Member,致力于單晶氮化鎵功率器件的研究工作，主持國(guó)家科技部重大研發(fā)計(jì)劃課題、國(guó)家自然科學(xué)基金、廣東省自然科學(xué)基金杰出青年項(xiàng)目等重要科研項(xiàng)目。研究成果發(fā)表 IEEE EDL/TED、Materials Today、Advanced Materials等論文 110 多篇，作為第一完成人，榮獲 2021 年度廣東省高?？萍汲晒D(zhuǎn)化總決賽銅獎(jiǎng)、2022 年廣東省科技進(jìn)步二等獎(jiǎng)、2022 年中國(guó)電子學(xué)會(huì)科技進(jìn)步二等獎(jiǎng)、2022 年廣東省電子學(xué)會(huì)科技進(jìn)步二等獎(jiǎng)、2023年深圳市青年科技獎(jiǎng)。

英文簡(jiǎn)介

Liu Xinke, Associate Professor at Shenzhen University, Fellow of the Institute of Physics (FInstP)、Fellow of the Royal Society of Chemistry (FRSC)、IEEE Senior Member. He is dedicated to the research of single crystal gallium nitride power devices and has led important research projects such as the Major R&D Program of the Ministry of Science and Technology, the National Natural Science Foundation of China, and the Outstanding Youth Program of the Guangdong Provincial Natural Science Foundation. The research results have been published in over 110 papers, including IEEE EDL/TED, Materials Today, and Advanced Materials. As the first author, he has won the bronze award in the 2021 Guangdong University Science and Technology Achievement Transformation Finals, the second prize in Guangdong Province Science and Technology Progress in 2022, the second prize in China Electronics Society Science and Technology Progress in 2022, and the second prize in Guangdong Electronics Society Science and Technology Progress in 2022, Shenzhen Youth Science and Technology Award in 2023.

英文名

Jiang Yang

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

射頻異質(zhì)異構(gòu)集成全國(guó)重點(diǎn)實(shí)驗(yàn)室毛軍發(fā)院士團(tuán)隊(duì)骨干，廣東省青年人才，深圳大學(xué)“百人計(jì)劃”副教授， IEEE電磁兼容協(xié)會(huì)新加坡分會(huì)執(zhí)行委員。致力于部分元等效電路方法的異質(zhì)異構(gòu)集成仿真和電路驅(qū)動(dòng)的人工智能仿真優(yōu)化算法研究。已發(fā)表IEEE論文20余篇，其中IEEE T-MTT等領(lǐng)域頂級(jí)期刊論文5篇，獲得5項(xiàng)新加坡科技局專(zhuān)利和2項(xiàng)軟件著作權(quán)。主持國(guó)家重點(diǎn)研發(fā)課題1項(xiàng)、全國(guó)重點(diǎn)實(shí)驗(yàn)室自主課題1項(xiàng)、作為技術(shù)骨干參與新加坡重點(diǎn)項(xiàng)目1項(xiàng)、橫向產(chǎn)業(yè)應(yīng)用項(xiàng)目1項(xiàng)

英文簡(jiǎn)介

Dr. Jiang Yang, graduated from the Chinese University of Hong Kong, previously worked at the Institute of High-Performance Computing. A*STAR in Singapore. He is currently an Associate Professor of the 'Hundred Talents Program' at Shenzhen University. He is a Guangdong Province Young Talent and an Executive Committee Member of the IEEE Electromagnetic Compatibility Society Singapore Chapter. He is/was the Principal Investigator of a National Key R&D Program at the National Key Laboratory of RF Heterogeneous Integration

He has been dedicated to research on heterogeneous and heterogeneous integration simulation using the Method of Partial Element Equivalent Circuits (PEEC) and circuit-driven AI simulation optimization algorithms.He has developed a series of PEEC-based software, including methods and engines for modeling and simulation of heterogeneous integration, intelligent design of metamaterials, air discharge reliability simulation, and non-contact detection simulation, addressing cutting-edge problems. He has received five patents from A*STAR and two software copyrights.

Dr. Jiang has published more than 20 IEEE papers, including five in top journals such as IEEE T-MTT. His proposed AI circuit reconstruction method won the 'Highly-Recommended Paper Award' at the 2022 Asia-Pacific Electromagnetic Compatibility Conference.

英文名

Dingguan Wang

聯(lián)系郵箱

[email protected]

中文簡(jiǎn)介

王定官，助理教授/副研究員，博士生導(dǎo)師，射頻異質(zhì)異構(gòu)集成全國(guó)重點(diǎn)實(shí)驗(yàn)室成員。2013年本科畢業(yè)于華中科技大學(xué)，2016年從中國(guó)人民大學(xué)獲得碩士學(xué)位（導(dǎo)師：王亞培），2021年從新加坡國(guó)立大學(xué)獲得博士學(xué)位（導(dǎo)師：Andrew Wee和Jishan Wu）。主要從事低維半導(dǎo)體薄膜制備與功能器件、射頻異質(zhì)異構(gòu)集成電路等方面的研究，發(fā)表論文30余篇。曾獲學(xué)術(shù)新星提名獎(jiǎng)，研究生國(guó)家獎(jiǎng)學(xué)金，優(yōu)秀畢業(yè)生，優(yōu)秀墻報(bào)獎(jiǎng)等榮譽(yù)獎(jiǎng)勵(lì)。長(zhǎng)期擔(dān)任ACS Nano，Small，Langmuir， Materials Today Electronics等學(xué)術(shù)期刊的審稿人。

英文簡(jiǎn)介

Dr. Dingguan Wang, Assistant Professor/Associate Researcher, Ph.D advisor, Member of National Key Laboratory of RF Heterogeneous Integration. Dr. Dingguan received his bachelor's degree from Huazhong University of Science and Technology in 2013, his master's degree from Renmin University of China in 2016 (Advisor: Prof. Yapei Wang), and his doctorate degree from National University of Singapore in 2021 (Advisors: Prof. Andrew Wee and Prof. Jishan Wu). Dr.Dingguan has been a reviewer for academic journals such as ACS Nano, Small, Langmuir, Materials Today Electronics.

Research Area: low-dimensional semiconductor synthesis and electronic devices, RF heterogeneous integrated circuits.

Awards: the Academic Rising Star Nomination Award, graduate National Scholarship, outstanding graduate, excellent poster award and other honorary awards.